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Plating Equipment Product List

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Plating device "Chibi Plating"

A simple operation specialized for one ring! The definitive small plating device!

"Chibi Meki" is a compact plating device designed for simple operation, specifically for plating one ring. It is pre-set to the current value suitable for one ring, so there is no need to adjust the current during use. The liquid temperature is electronically controlled to be optimal for rhodium plating solution. 【Features】 ■ Specialized for one ring (pre-set to the current value for one ring) ■ Simple operation compact plating device ■ No current adjustment needed ■ Electronically controlled to the optimal liquid temperature for rhodium plating solution Videos are available on the Harp website. *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment

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Plating device "Plating Basic"

Pursuing ease of use and compactness! Adopting a constant current control circuit eliminates the need for current density adjustment!

The "Mekki Basic" is a plating device that improves workability by adopting a constant current control circuit, eliminating the need for cumbersome current density adjustments. It maintains the plating solution at an appropriate temperature using a heater installed in the plating tank. The temperature can be selected from 45°C and 55°C, allowing for flexible operation tailored to the plating solution. We also offer a compact plating device called "Chibi Mekki," which is specifically designed for plating a single ring with simple operation. 【Features】 ■ Adoption of constant current control circuit ■ No need for current density adjustments ■ Maintains plating solution at an appropriate temperature with a heater installed in the plating tank ■ Selectable between 45°C and 55°C *For more details, please refer to the PDF document or feel free to contact us.

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